Equipment

 
Tool, model, description
UHV Atomic Layer Deposition system Al2O3 and TiO2 thin films (<50 nm), 100 mm wafers, load-lock
UHV programmable multi-segment CVD reactor Combinatorial CVD
Inficon X-ray photoelectron spectroscopy (XPS) Thin film analysis
Tube furnace Atomic Layer Deposition reactor TiN and HfO2 thin films
Annealing furnace, 1000C, Lindberg Thin film annealing in O2 or N2
Sopra GES5 spectroscopic ellipsometer Thickness and refraction index measurements, auto XY mapping and variable angles, VIS-UV range, microspot
Automated probe station Auto XY mapping of IV, CV, sheet resistance and film thickness
HP 4145B Semiconductor paramater analyzer IV characterization, leakage current
Agilent E4980A 20Hz-2MHz Precision LCR meter CV characterization, permittivity
Residual gas analyzer, Vision 1000C, MKS, 300 amu CIS Mass-spectrometer for in-situ chemical sensing in ALD
Residual gas analyzer, Inficon 300 amu CIS Mass-spectrometer for in-situ chemical sensing in ALD
Residual gas analyzer, Inficon 200 amu CIS Mass-spectrometer for in-situ chemical sensing in ALD
Gas phase acoustic sensor, Inficon Composer Process sensing
FTIR compact spectrometer, Inficon Process sensing
8" sol-gel spincoater, SP 100 Bidtec controller  
8" photoresist spincoater, SP 100 Bidtec controller  
Programmable hot plate, 400C; for sol-gel and photoresist  
Programmable furnace, Vulcan 3-550, NEY
Oven, Blue M, Electric Gal. Signal
Oven, Lindberg, Electric Gal. Signal
Sartorius A210P  microbalance, 1/10000g
Microscope, Ferroscope
Last updated: Feb. 2009 by Henn-Lecordier
   

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Laboratory for Advanced Materials Processing, University of Maryland - 2009